- What just happened — four new approvals
- Project map and types (fab vs. OSAT/ATMP vs. compound)
- Realistic timelines & outputs (2025–27)
- Why OSAT first — the operating logic
- Milestones and risks for the next 12 months
The short
- Four new projects cleared. Odisha (2), Andhra Pradesh, Punjab — taking sanctioned units to ~10.
- Near-term output is packaging-heavy. ATMP/OSAT lines can ship within 12–18 months; fab ramps are multi-year.
- Anchor nodes are in Gujarat and Assam. Micron ATMP, Kaynes OSAT, TSAT Assam lead 2025 shipments; Dholera fab ramps 2026–27.
Project map & types
Wafer Fabs
Mature nodes for auto/industrial at Dholera. Long lead Yield climb
OSAT / ATMP
Sanand, Assam hubs for assembly & test. Faster go-live Talent ramp
Compound Semis (SiC / 3DHI)
Odisha approvals add high-value packaging/SiC capacity. Power devices 3D glass
Policy & Incentives
Stacked central/state support, cluster infra, and supply-chain tie-ups. MoUs Utilities
Timelines & outputs
| Project | Location | Type | Status / indicative timing |
|---|---|---|---|
| SiCSem (with Clas-SiC) | Bhubaneswar, Odisha | SiC / fab elements | Cabinet-approved Aug 12; DPR & site prep next. |
| 3D Glass Solutions | Bhubaneswar, Odisha | Advanced packaging (3DHI) | Cabinet-approved Aug 12; high-density packaging focus. |
| CDIL | Mohali, Punjab | Analog/discrete + packaging | Cabinet-approved Aug 12; expansion/modernisation path. |
| ASIP Technologies | Andhra Pradesh | System-in-Package (SiP) | Cabinet-approved Aug 12; details with DPR. |
| Micron ATMP | Sanand, Gujarat | ATMP | Operational readiness 2025; DRAM/NAND packaging. |
| Tata–PSMC | Dholera, Gujarat | Wafer fab | Mature nodes; ramp through 2026–27. |
| Tata TSAT | Jagiroad, Assam | OSAT | Operations commencing 2025; phased scale-up. |
| Kaynes Semicon | Sanand, Gujarat | OSAT | Samples around Sep 2025; commercial by Dec 2025. |
| CG Power–Renesas–Stars | Sanand, Gujarat | OSAT | Pilot by mid-2026; mass production 2027. |
Key: OSAT/ATMP = assembly & test; DPR = Detailed Project Report.
Why OSAT first?
- Speed-to-market: Shorter tool lead times and fewer utility constraints than greenfield fabs.
- Talent ramp: Builds technician/QA base that fabs later absorb.
- FX resilience: Packaging in India reduces finished-chip import exposure ahead of local wafer output.
Milestones to watch
- Kaynes Sanand: samples → customer quals → commercial ops.
- Micron Sanand: cleanroom readiness and outbound logistics cadence.
- Dholera fab: utilities uptime, tool-move timelines, specialty-chemical offtakes.
- Odisha/AP/Punjab projects: DPRs, land allotments, incentive tie-ups.
Risks
- Global tool bottlenecks elongating fab critical path.
- Yield climb on initial nodes; vendor hand-holding needed.
- Cycle sensitivity at OSATs (handset/server demand).